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OPA548(DDPAK封装)散热焊盘处理

Other Parts Discussed in Thread: OPA548, OPA549

OPA548(DDPAK封装)在采用PCB敷铜散热时,有两个问题,请教一下:

1)散热焊盘是否需要接到地平面?我看到有人说有些片子需要接地,因为散热焊盘是衬底,需提供稳定的电位。

2)在画DDPAK封装库时,不提供引脚标号(原理也没有对应标号),能正常导入PCB吗?